Description

1pcs BGA IC Chipset solder reballing template / stencil

It is only a template for chipset use.
Pls be sure which size of template, and prefer to notice correct model or part number before order.
If need OEM size or BGA type, pls contact us.
BGA Balls item, click here.
More soldering item, click here.
Need more this item or out of stock, contact us.

Additional information

Weight	49 g
Template Size	100x100mm, 75x75mm, 80x80mm (79mm), 90x90mm
Balls Diameter	0.45mm
Brand of Product	OEM

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Shipping & Delivery

Handling Process and Time >>>
Within 2 days, we will picking products from inventory, quality checks, and packaging.
The tracking number would be release and allows customers to monitor the shipment's progress during transit.

Shipping  and Delivery (World Wide Suooprt) >>>
Free shipping approx 7-15 days, Standard Shiping approx 5-12 days, Expedit Service approx 2-4 Days.
Local logistic serivce approx 1-7 days (support USA, Britain, Europe and Asia)

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75 80 90 100 mm Samsung Hynix RAM IC GDDR2 DDR2 84pin reballing soldering template stencil IC chipest

Name: 75 80 90 100 mm Samsung Hynix RAM IC GDDR2 DDR2 84pin reballing soldering template stencil IC chipest
SKU: BGAT-20111215025817
Availability: InStock