Description

1pcs BGA IC Chipset solder reballing template / stencil

It is only a template for chipset use.
Pls be sure which size of template, and prefer to notice correct model or part number before order.
If need OEM size or BGA type, pls contact us.
BGA Balls item, click here.
More soldering item, click here.
Need more this item or out of stock, contact us.

Additional information

Weight	31 g
Balls Diameter	0.5mm
Brand of Product	OEM

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Shipping & Delivery

Handling Process and Time >>>
Within 2 days, we will picking products from inventory, quality checks, and packaging.
The tracking number would be release and allows customers to monitor the shipment's progress during transit.

Shipping  and Delivery (World Wide Suooprt) >>>
Free shipping approx 7-15 days, Standard Shiping approx 5-12 days, Expedit Service approx 2-4 Days.
Local logistic serivce approx 1-7 days (support USA, Britain, Europe and Asia)

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0.5mm nVidia G86 603 630 631 Small BGA kit directly Heat reballing soldering template stencil

Name: 0.5mm nVidia G86 603 630 631 Small BGA kit directly Heat reballing soldering template stencil
SKU: BGAT-20111208070527
Price: 3.80 USD
Availability: InStock