Description

1 Bottle BGA Balls for IC chipset solder reballing

Brand: P.M. Technology (Taiwan)

Balls Size: as title

Balls Alloy: Sn 63 / Pb 37 (Pb Leaded)

SN96.5% / AG3% / Cu0.5% (Rohs Pb free)

QTY: 1 Bottle

Condition: New & Unused

Payment: Paypal, T/T (Bank Transfer)

Remark:

More BGA products, click here.
Need more this itme, out of stock, and customize spec or alloy, pls contact us.

Additional information

Weight	51 g
Balls Type	Pb free Rohs, Pb Leaded
Balls Diameter	0.35mm
Brand	Profound Material Technology

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Shipping & Delivery

Handling Process and Time >>>
Within 2 days, we will picking products from inventory, quality checks, and packaging.
The tracking number would be release and allows customers to monitor the shipment's progress during transit.

Shipping  and Delivery (World Wide Suooprt) >>>
Free shipping approx 7-15 days, Standard Shiping approx 5-12 days, Expedit Service approx 2-4 Days.
Local logistic serivce approx 1-7 days (support USA, Britain, Europe and Asia)

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0.35mm 250k 250000 pcs BGA balls IC Chipset reballing resoldering Leaded / Pb free Rohs SGS

Name: 0.35mm 250k 250000 pcs BGA balls IC Chipset reballing resoldering Leaded / Pb free Rohs SGS
SKU: BGAT-20111108073654
Availability: InStock