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Home » Shop » Thermal Compound paste heat sink carbon based high performance temperature cooling Silicone Grease Syringe used as IC CPU GPU vga chipset
75 80 90 100 mm nVidia G98-103-A3 BGA template stencil reballing soldering IC chipest
75 80 90 100 mm nVidia G98-103-A3 BGA template stencil reballing soldering IC chipest NT$188.49 – NT$497.22
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Thermal Compound paste heat sink carbon based high performance temperature cooling Silicone Grease Syringe used as IC CPU GPU vga chipset

NT$162.17 – NT$2,274.54

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Syringe Tube Thermal heatsink compounds Grease silicone paste for CPU IC GPU VGA chipset white Gray

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SKU: HEATSKPST-ALL Categories: Professional Tools, Solder Tools
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Description
 
Syringe Theraml Heatsink compounds
High thermal conductivity and low thermal resistance, with excellent thermal conductivity;
Low viscosity, with certain thixotropy, low oil separation;
Excellent electrical insulation performance and aging resistance;
Good construction performance, suitable for various construction techniques such as screen printing,dispensing and smearing;
Excellent resistance to high and low temperature range performance, can be used in the environment of -55 ℃ ~ 240 ℃.
 
12.8w

    12.8W Syringe Theraml Heatsink compounds

  • color: gray
  • Thermal conductivity W/m·K 12.8
  • Non-toxic, tasteless, non-corrosive
  • Thermal resistance (40PSI) ℃·cm2/W <0.03
  • Density g/cm3 >3.42   
  • Viscosity (25℃) 100Pa·s 
  • Cone penetration 1/10mm 300±10
  • Volatile matter (200℃)% <0.02
  • Oil separation degree (200℃)% <0.02
  • Dielectric strength (AC) Kv/mm ≥6.0
  • Volume resistivity Ω·cm >1013
  • Working temperature ℃ -60~250
  • Net Weight: approx. 1.0g         
  • Accessory ONLY.  
5w

   

    5W Syringe Theraml Heatsink compounds

  • color: gray
  • Thermal conductivity W/m·K 5
  • Non-toxic, tasteless, non-corrosive
  • Thermal resistance (40PSI) ℃·cm2/W <0.055
  • Density g/cm3 >2.96
  • Viscosity (25℃) 100Pa·s
  • Cone penetration 1/10mm 300±10
  • Volatile matter (200℃)% <0.08
  • Oil separation degree (200℃)% <0.05
  • Dielectric strength (AC) Kv/mm ≥6.0
  • Volume resistivity Ω·cm >1013
  • Working temperature ℃ -55~240
  • Net Weight: approx. 1.0g 
  • Accessory ONLY.  

RoHS —- Compliant
More Chipset Tool products, click here.
Need More this item or out of stock, please contact us.
Additional information
Weight 12.5 g
Thermal paste

12.8W-2g, 12.8W-2g 10 PCS, 12.8W-4g, 5W-2g, 5W-2g 10 PCS, 5W-4g

Model Number

HEATSKPST-ALL

Product Type

heatsink compounds paste

Brand of Product

OSGEAR

UPC

768451065381(5W 2G) 768451065404(5W 4G) 768451065398(12.8W 2G) 768451065411(12.8W 4G)

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Shipping & Delivery
Handling Process and Time >>>
Within 2 days, we will picking products from inventory, quality checks, and packaging.
The tracking number would be release and allows customers to monitor the shipment's progress during transit.

Shipping  and Delivery (World Wide Suooprt) >>>
Free shipping approx 7-15 days, Standard Shiping approx 5-12 days, Expedit Service approx 2-4 Days.
Local logistic serivce approx 1-7 days (support USA, Britain, Europe and Asia)

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