intel E62476-001 BXSTS200C LGA 2011 2066 CPU Cooler Cooling Fan Thermal Solution Heatsink

Intel STS200C Thermal Solution for Xeon Workstations and Servers

The Intel STS200C CPU fan cooling cooler heatsink is an original cooling solution designed specifically for LGA2011 / 2066 (Socket R) platforms, widely used in Intel Xeon workstation and server environments.

Featuring a hybrid active/passive cooling design, this cooler includes a detachable fan module, allowing flexible configurations depending on airflow requirements. The combination of aluminum fins and copper heatpipes/base ensures efficient heat transfer and stable thermal performance under heavy workloads.

With support for up to 150W TDP, the STS200C is optimized for high-performance processors, maintaining system stability even under continuous operation.

Due to its ~9.1 cm height, this cooler is best suited for 2U or larger server chassis and professional workstation systems, rather than ultra-slim 1U environments.

Compatible Models / Part Numbers:

E62476-001, BXSTS200C, STS200C

Key Specifications

Cooling Design:

• Type: Active / Passive Hybrid (Detachable Fan)
• Heatsink Material: Aluminum fins + Copper heatpipes/base
• Structure: High-efficiency thermal design for server workloads

Compatibility:

• Deminsion: 91.5 x 91.5 x 64 mm
• Socket: Intel LGA2011 / 2066 (Socket R)
• Application: Xeon CPU / Workstation / Server systems

Performance:

• TDP Support: Up to 150W
• Cooling Capability: Designed for continuous high-load operation

Fan & Connectivity:

• Fan Type: Detachable active cooling fan
• Connector: 3-Pin

Physical Details:

• Height: Approx. 9.1 cm
• Weight: Approx. 0.45 – 1.32 kg (depending on configuration/packaging)

Key Advantages

• Copper Heatpipe Design – Efficient heat transfer for high-performance CPUs
• Hybrid Cooling System – Flexible active or passive cooling configuration
• 150W TDP Support – Suitable for Xeon and workstation processors
• Intel Original Quality – Reliable and stable long-term operation
• Server-Optimized Design – Ideal for 2U+ rackmount systems
• Detachable Fan Module – Easy maintenance and configuration

Applications

• Intel Xeon workstation cooling
• Server systems (2U and above)
• High-load computing environments
• Replacement for Intel original STS200C Thermal solution