Description

1 Bottle BGA Balls for IC chipset solder reballing

Brand: P.M. Technology (Taiwan)

Balls Size: as title

Balls Alloy: Sn 63 / Pb 37 (Pb Leaded)

SN96.5% / AG3% / Cu0.5% (Rohs Pb free)

QTY: 1 Bottle

Condition: New & Unused

Payment: Paypal, T/T (Bank Transfer)

Remark:

Additional information

Weight	31 g
Balls Type	Pb free Rohs, Pb Leaded
Balls Diameter	0.5mm
Brand	Profound Material Technology

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