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Specification >>>
| General information | |
| Type | CPU / Microprocessor |
| Market segment | Server |
| Family | Intel Xeon 5500 |
| Model number | W5590 |
| CPU part numbers | |
| AT80602000753AA is an OEM/tray microprocessor | |
| BX80602W5590 is a boxed microprocessor | |
| Frequency | 3333 MHz |
| Turbo frequency | 3600 MHz |
| Bus speed | 6.4 GT/s QPI (3200 MHz) |
| Package | 1366-land Flip-Chip Land Grid Array (FC-LGA8) |
| 1.77″ x 1.67″ (4.5 cm x 4.25 cm) | |
| Socket | Socket 1366 / B / LGA1366 |
| Introduction date | 9-Aug-09 |
| End-of-Life date | Last order date is September 28, 2012 |
| Last shipment date for tray processors is March 27, 2015 | |
| S-spec numbers | |
| Part number | Production processors |
| Q1GW | |
| AT80602000753AA | + |
| BX80602W5590 | |
| Architecture / Microarchitecture | |
| Microarchitecture | Nehalem |
| Platform | Tylersburg-EP |
| Tylersburg-EN | |
| Tylersburg-WS | |
| Processor core | Nehalem-EP |
| Core stepping | SLBGE |
| Manufacturing process | 0.045 micron |
| 731 million transistors | |
| Die | 263mm2 |
| Data width | 64 bit |
| The number of CPU cores | 4 |
| The number of threads | 8 |
| Floating Point Unit | Integrated |
| Level 1 cache size | 4 x 32 KB 4-way set associative instruction caches |
| 4 x 32 KB 8-way set associative data caches | |
| Level 2 cache size | 4 x 256 KB 8-way set associative caches |
| Level 3 cache size | 8 MB 16-way set associative shared cache |
| Physical memory | 144 GB |
| Multiprocessing | Up to 2 processors |
| Features | |
| MMX instructions | |
| SSE / Streaming SIMD Extensions | |
| SSE2 / Streaming SIMD Extensions 2 | |
| SSE3 / Streaming SIMD Extensions 3 | |
| SSSE3 / Supplemental Streaming SIMD Extensions 3 | |
| SSE4 / SSE4.1 + SSE4.2 / Streaming SIMD Extensions 4 | |
| EM64T / Extended Memory 64 technology / Intel 64 | |
| NX / XD / Execute disable bit | |
| HT / Hyper-Threading technology | |
| VT-x / Virtualization technology | |
| VT-d / Virtualization for directed I/O | |
| TBT / Turbo Boost technology | |
| Low power features | |
| Thread C1/C1E, C3 and C6 states | |
| Core C1/C1E, C3 and C6 states | |
| Package C1/C1E, C3 and C6 states | |
| Enhanced SpeedStep technology | |
| Integrated peripherals / components | |
| Integrated graphics | None |
| Memory controller | The number of controllers: 1 |
| Memory channels: 3 | |
| Supported memory: DDR3-800, DDR3-1066, DDR3-1333 | |
| Maximum memory bandwidth (GB/s): 32 | |
| ECC supported: Yes | |
| Other peripherals | Quick Path Interconnect (2 links) |
| Electrical / Thermal parameters | |
| V core | 0.75V – 1.35V |
| Maximum operating temperature | 67°C |
| Thermal Design Power | 130 Watt |
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